For a high thermal density MIL-STD Tempest Rackmount Chassis, thermal design work is carried out according to the process. Taking the heat consumption of each module in the customized chassis as the input condition and the structural requirements as the boundary condition, the selection of cooling mode, the thermal installation of the module, the design of the air duct, the thermal simulation analysis, the optimization design and the experimental verification are carried out in turn.
Through strong data support, the feasibility of this thermal design scheme is fully demonstrated, and the reliability of the device is improved, which can provide a reference for the thermal design of other similar electronic products.
In recent years, with the rapid development of big data and cloud computing technologies, the performance requirements for server cabinets have become higher and higher. This is mainly reflected in the substantial increase in chip integration and module assembly density, resulting in high thermal density inside the chassis.
For example, the internal heat consumption of the new generation of shipboard reinforced chassis can reach the kilowatt level, and the heat flux density at the package level can exceed 30w/cm2. The airtight and reinforced chassis is widely used in military environments due to its good anti-vibration and impact performance, three-proof performance and electromagnetic compatibility performance.
However, this also causes the heat-generating components inside the chassis to be isolated from the outside air, increasing the difficulty of heat dissipation and making the temperature continue to rise. The reliability of power devices is closely related to its temperature. The US Air Force’s overall plan analysis report pointed out that 55% of the failures of electronic equipment are caused by temperature.
In the electronics industry, a 10°C increase in the ambient temperature of a device tends to increase the failure rate by an order of magnitude, which is known as the “10°C rule”. In the product design process, designers need to combine structural and thermal design into a unified consideration, assist thermal design by optimizing structural layout, and in turn support structural dimensions through thermal design. The two iterative and integrated design will help improve the integration and reliability of the entire system.
